We build schematic symbols, IPC-compliant footprints and clean part data for PCB design teams — verified pin by pin against the datasheet, reviewed by engineers, and delivered in the CAD format your workflow already uses.
Pin map verified
3D STEP attached
Courtyard · 0.25 mm
Built for the tools your team already runs
Supported tools include Altium Designer, Cadence Allegro, OrCAD Capture, Siemens Xpedition, PADS Professional, KiCad, Zuken CR-8000 and IPC-2581 data exchange.
From a single datasheet-to-footprint build to a full library migration, eight services cover the component data lifecycle — symbols, land patterns, part data and layout support.
Land patterns built to the density your assembly line actually uses — courtyard, mask and paste defined, thermal pads vias-checked, and a STEP body that drops into your mechanical assembly.
Multi-part symbols with correct pin types, power pins and alternate functions — ERC-clean, mapped to the exact package variant, and drawn the way your team expects.
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One governed library with part numbers, revisions and a review trail — so two engineers never place two versions of the same capacitor.
Learn moreAlso: component data enrichment · BOM & AVL · layout support · DFM review · obsolescence
See all eight servicesIt shows up as a rotated connector, a tombstoned 0402, or a re-spin two weeks before launch. We treat component data as engineering output, not data entry — because at 0.4 mm pitch, the difference is measured in microns and money.
Every dimension, pin number and package variant is checked against the manufacturer's current drawing and errata.
Pad geometry, pin-1 orientation, courtyard and 3D body are compared before anything reaches your vault.
Part numbers, descriptions and parameters follow your conventions — or we help define a scheme that scales past 10,000 parts.
Native Altium, Allegro, PADS, Xpedition and KiCad libraries, plus neutral STEP, IPC-2581 and PDF drawings.
No black box. You see the source, the checks and the revision at every stage — and every delivery ships with a review report you can file.
Send datasheets, a BOM or your existing library. We flag duplicates, missing 3D models and parts that break your conventions.
We read the current datasheet revision, note package variants, pin functions and any errata that affect the land pattern.
Symbol, footprint and 3D body are created in your template, with naming, parameters and revision metadata applied.
Peer review, ERC/DRC, courtyard check, 3D clearance and a print-to-scale check against the manufacturer drawing.
Native library files, a change log and a review report. Revisions become a diff, not a rebuild.
Most parts are delivered in 2–4 working days. Complex BGA, connector and module builds are quoted separately.
Start with a library auditA short field guide to the standards and decisions behind every part we build. Use it to brief us, or to sanity-check the library you already have.
A land pattern is more than pads. It is pad geometry, solder-mask opening, paste aperture, courtyard and assembly outline — each derived from the package drawing and the density level your process can actually support.
Exact values depend on the package body, lead form and your assembly process. Always confirm against the current manufacturer drawing.
Once the fab stackup is fixed, trace width and dielectric height set your characteristic impedance. Chasing 50 Ω after routing usually means thinner traces, more layers or a controlled-impedance note — all cheaper to plan early.
Impedance targets follow the interface spec — USB 2.0 at 90 Ω and PCIe/Ethernet at 100 Ω are common starting points.
DFM is not a final checkbox. Annular ring, mask webs, silkscreen clearance and component spacing all come from the same place: the capability of the fab and the assembly house you chose.
These are typical limits. Your fab's capability sheet always wins — we build footprints to the tighter of the two.
The footprint gets the board built; the data keeps it manufacturable. MPN, manufacturer, lifecycle status and approved alternates decide whether the design survives procurement three months from now.
Match these fields to your ERP/PLM keys before the migration starts, not after 4,000 records are loaded.
Component designers, a QC engineer and a client-facing technical lead — close enough to the work that questions get answered by the person who built the part.
Led by Shashank Goswami, with QC and data curation by Raja Banerjee.
Tell us the package, the density level and the CAD tool you use. We'll come back with a scope, a price and a delivery format in one reply.
